RUDOLPH TECHNOLOGIES Industrial Partner

NSX105 - Rudolph Technologies NSX105 MEI Daughter Card Simple Type: Control Board

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Part Number:
NSX105
Model Number:
NSX105
Make:
RUDOLPH TECHNOLOGIES
Lead Time:
Available
Qty In Stock:
Available

Rudolph Technologies NSX105 MEI Daughter Card Simple Type: Control Board

The NSX Series is a proven high-throughput and repeatable macro defect inspection solution used throughout the device manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX quickly and accurately detects yield-inhibiting defects, providing quality assurance and valuable process information. This information may be transferred to Discover®, Rudolph's yield management software, for further analysis and review.

For Resellers and High Volume Orders:
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Features

  • Automated, 100% advanced macro defect inspection
  • Fast and consistent 2D bump inspection
  • Provides process and defect information for enhanced process control and product consistency
  • Time-tested applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets

Specifications


 

Applications

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